W972GG6JB
7.3
7.3.1
Command Function
Bank Activate Command
( CS ="L", RAS ="L", CAS ="H", WE ="H", BA0, BA1, BA2=Bank, A0 to A13 be row address)
The Bank Activate command must be applied before any Read or Write operation can be executed.
Immediately after the bank active command, the DDR2 SDRAM can accept a read or write command
on the following clock cycle. If a Read/Write command is issued to a bank that has not satisfied the
t RCDmin specification, then additive latency must be programmed into the device to delay when the
Read/Write command is internally issued to the device. The additive latency value must be chosen to
assure t RCDmin is satisfied. Additive latencies of 0, 1, 2, 3, 4, 5 and 6 are supported. Once a bank has
been activated it must be precharged before another Bank Activate command can be applied to the
same bank. The bank active and precharge times are defined as t RAS and t RP , respectively. The
minimum time interval between successive Bank Activate commands to the same bank is determined
by the RAS cycle time of the device (t RC ). The minimum time interval between Bank Activate
commands is t RRD .
In order to ensure that components with 8 internal memory banks do not exceed the instantaneous
current supplying capability, certain restrictions on operation of the 8 banks must be observed. There
are two rules. One for restricting the number of sequential ACT commands that can be issued and
another for allowing more time for RAS precharge for a Precharge All command. The rules are as
follows:
?
?
Sequential Bank Activation Restriction: No more than 4 banks may be activated in a rolling t FAW
window. Converting to clocks is done by dividing t FAW [nS] by t CK (avg)[ns], and rounding up to
next integer value. As an example of the rolling window, if RU{ (t FAW / t CK (avg) } is 10 clocks,
and an activate command is issued in clock N, no more than three further activate commands
may be issued at or between clock N+1 and N+9.
Precharge All Allowance: t RP for a Precharge All command is equal to tn RP + 1 x n CK , where
tn RP = RU{ t RP / t CK (avg) } and t RP is the value for a single bank precharge.
T0
T1
T2
T3
Tn
Tn+1
Tn+2
Tn+3
CLK
CLK
Internal RAS - RAS delay ( ≥ t RCD min)
Address
Bank A
Row Addr.
Bank A
Col. Addr.
Bank B
Row Addr.
Bank B
Col. Addr.
Bank A
Addr.
Bank B
Addr.
Bank A
Row Addr.
CAS - CAS delay time(t CCD )
t RCD = 1
Additive Latency delay(AL)
Read Begins
RAS - RAS delay time(≥ t RRD )
Command
Bank A
Activate
Bank A
Post CAS
Read
Bank B
Activate
Bank B
Post CAS
Read
Bank A
Precharge
Bank B
Precharge
Bank A
Activate
Bank Active ( ≥ t RAS )
Bank Precharge time ( ≥ t RP )
RAS Cycle time (≥ t RC )
Figure 12 – Bank activate command cycle: t RCD = 3, AL = 2, t RP = 3, t RRD = 2, t CCD = 2
Publication Release Date: Nov. 29, 2011
- 20 -
Revision A02
相关PDF资料
W9751G6IB-25 IC DDR2-800 SDRAM 512MB 84-WBGA
W9751G6KB-25 IC DDR2 SDRAM 512MBIT 84WBGA
W9812G6JH-6I IC SDRAM 128MBIT 54TSOPII
W9816G6IH-6I IC SDRAM 16MBIT 50TSOPII
W9825G6JH-6I IC SDRAM 256MBIT 54TSOPII
W9864G6JH-6I IC SDRAM 64MBIT 54TSOPII
WM-5614 CABINET WALL MOUNT 37.25X17.9"
WRR-2244 RACK WALL MOUNT RELAY 42" X 19"
相关代理商/技术参数
W972GG8JB 制造商:WINBOND 制造商全称:Winbond 功能描述:32M ??′ 8 BANKS ??′ 8 BIT DDR2 SDRAM
W972GG8JB-18 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 1.875NS BGA
W972GG8JB-25 制造商:Winbond Electronics Corp 功能描述:2GMB DDRII 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 2.5NS 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 2.5NS 60WBGA
W972GG8JB-25I 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 2.5NS 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 2.5NS 80WBGA
W972GG8JB-3 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 2G-Bit 256Mx8 1.8V 60-Pin WBGA 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 3NS
W9751G6IB-25 功能描述:IC DDR2-800 SDRAM 512MB 84-WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.173",4.40mm 宽) 供应商设备封装:8-MFP 包装:带卷 (TR)
W9751G6JB 制造商:WINBOND 制造商全称:Winbond 功能描述:8M ? 4 BANKS ? 16 BIT DDR2 SDRAM
W9751G6JB-25 制造商:Winbond Electronics Corp 功能描述:512GB DDRII